# Heat Transfer Coefficients using a Cylindrical Fin Array

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i need:

2. results and discussion: just follow the objective statement and run tests required.

3. Conclusion.

all info is in the report, use Tbase of 20 w on varied air velocity part. power is always 20w for varied air velocity.

image 1&2 for important data: measurement and Tbase.

let me know if you have questions.

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Thomas574
School: New York University

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Establishing Heat Transfer Coefficients using a Cylindrical Fin Array

Last Name, Group R6

Abstract
The reason for conducting the experiment was to establish Heat Transfer Coefficients using a
Cylindrical Fin Array. Heat transfer coefficients are widely used in cooling substances to the
required temperatures through heat transfer mechanisms such as conduction and convection.
Normally, heat transfer through convection is high compared to conduction. This is because in
convection, we have bulk movement of fluid as compared to conduction whereby heat energy
transfers by molecular collision. The experimental objectives involved:- To determine the
relationship of the heat transfer coefficient of the cylindrical fin array to the power supplied to the
array, to compare the results collected to the heat transfer coefficient of a single fin, using
previously published correlations which allow for the coefficient to be calculated, to run a twosample t-test to compare the heat transfer coefficient calculated from the published findings to
the heat transfer coefficient calculated from the data collected. Among the equipment’s used
during the experiment are: - The Cylindrical Fin Array and fluids and metal solids of different
conductivity. The coefficient of heat transfer is usually expressed as W/(m2K). fluids such as gases
in free convection have a coefficient of heat between 5 -37 W/(m2K) whereas metallic conductors
have a coefficient value of approximately between 500-3000 W/(m2K). Therefore, by the end of
the experiment, we expected to have established different heat transfer coefficients using
cylindrical fin array mechanism. For the case of our experiment, the thermal coefficient values
obtained ranged between 24 to 25 W/(m2K).
Introduction/Background:
Often in processes, substances need to be cooled to maintain a desired temperature using
heat transfer, usually as a form of convection or conduction with the difference being convection
has bulk movement of heat in the fluid. Convection is a very useful method for heat transfer
because it relocates heat through bulk movement of fluid as opposed to conduction which is heat
transferred by molecular collision. With convection as the form of heat transfer, using an array of
fins is a common method used in industry. This is due to the additional surface area the fins
provide. Fins are often simple and consist of heat conducting rods, most commonly made of metal.
Fins are often more efficient with fluids that have a low boiling point and high heat capacity.
Incorporating the fin arrays on the equipment allows for greater heat transfer because the
additional surface area provides more space for convective heat transfer to occur. Fins are most
commonly found in industries that involve air conditioning, refrigeration, chemical processing
equipment or electrical chips. These industries consist of food production plants, chemical
processing plants, and the technology industry. In food production fins are used in air conditioning
units to provide heat transfer producing a refrigeration affect to perverse food and slow bacterial
growth (“Air Conditioner Fins: Everything You Need to Know For Your Avon AC System”). The
chemical processing industry utilizes fins for various applications such as the production of gases
and heat exchangers to separate and purify gases such as oxygen, nitrogen, and other rare gases

Last Name, Group R6

(“Plate Fin Heat Exchangers”). The technology industry is another recent industry that relies on
fins for efficient heat transfer. Fins are used frequently in the heat protection of microchips, a
product abundantly used in a plethora of manufactured goods. Goods such as computers, cell
phones, controllers, and thousands of other electrical devices are taking advantage of the ability
to change the shape of a microchip for heat protection, allowing them to avoid adjusting the
material of construction which may have to meet predetermined specifications.
The use of fins has become a very effective way to transfer heat and take advantage of
convection using increased surface areas. By understanding these concepts, it becomes possible
to use fin arrays to manipulate the heat transfer coefficient of a unit operation, as well as gain
understanding of alternate approaches that can be taken to optimize the heat transfer ...

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Anonymous
Top quality work from this guy! I'll be back!

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